COF Cutting and Forming 01 – Precision Laser Processing by AQ-Laser
COF Cutting and Forming 01
 

COF Cutting and Forming 01 – Advanced Laser Processing

This is a high-precision laser system for chip-on-film (COF) substrates, ideal for electronics and medical applications, offering exceptional accuracy.

The COF Cutting and Forming 01 from AQ-Laser is an advanced laser processing system designed for high-precision micromachining of chip-on-film (COF) substrates and related materials. Tailored for industries such as medical device manufacturing, consumer electronics, and display production, this system delivers clean, burr-free cuts and precise forming with minimal thermal impact. It supports a variety of flexible materials, including polyimide (PI), PET, and FCCL, enabling intricate circuit designs and high-density interconnects (HDI). Equipped with automated features like precise positioning and focusing, it ensures efficient, high-quality production for complex electronic components.

الميزات الرئيسية:

  • Ultra-Precise Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
  • تنوع المواد: Processes flexible substrates like polyimide (PI), PET, FCCL, and coverlay with ease.
  • Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
  • Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
  • CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.

Certification and Standards:

Conforms to global standards for electronics manufacturing. Adheres to strict quality and safety regulations.

مواد

COF Substrates:

  • High Flexibility: Enables bending and folding without compromising electrical performance, ideal for compact and wearable devices.
  • Miniaturization Support: Facilitates high-density interconnects (HDI) for intricate, space-saving circuit designs.
  • Durability: Resists mechanical stress and environmental factors, ensuring long-term reliability in demanding applications.
  • Thermal Stability: Maintains performance under high temperatures, suitable for advanced electronics and medical devices.
  • Lightweight Design: Reduces overall device weight, enhancing portability in consumer and medical applications.
  • Versatile Material Compatibility: Supports polyimide (PI), PET, and FCCL, allowing diverse manufacturing applications.
  • Precision Processing: Compatible with advanced laser cutting and forming, delivering clean, burr-free edges for high-quality production.

PET (Polyethylene Terephthalate):

  • Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
  • Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
  • Cost-Effective: Economical material for large-scale production of medical and electronic components.
  • Transparency: Ideal for optical applications in diagnostic and laboratory devices.

PI (Polyimide):

  • High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
  • Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
  • Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
  • Flexibility: Supports intricate designs in compact, high-performance electronic devices.

Copper Foil:

  • Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
  • Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
  • Thin and Lightweight: Enables precision applications in electronics and medical sensors.
  • Malleability: Easily shaped for intricate designs in circuit boards and conductive components.

Aluminum Foil:

  • Lightweight: Low density reduces overall weight in medical and industrial applications.
  • Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
  • High Conductivity: Supports efficient electrical and thermal performance in electronic components.
  • Cost-Effective: Affordable material for large-scale production of precision parts.
طلب
  • High-precision cutting and forming of COF substrates for medical devices, displays, and consumer electronics.
  • Contour cutting, drilling, and marking of flexible circuit materials.
  • Processing of cover films and adhesives for compact, high-performance electronics.
  • Suitable for high-density interconnect (HDI) designs in telecommunications and wearable technology.
تحديد
  • Laser Type: High-performance UV laser
  • Cutting Accuracy: ≤±10μm
  • Cutting Seam Width: 15–30μm
  • Material Compatibility: Polyimide (PI), PET, FCCL, coverlay
  • Processing Capabilities: Contour cutting, drilling, marking, and forming
  • Automation: Automatic positioning, focusing, and feeding systems
  • Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats

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  • آلات متخصصة للمكونات الجراحية.
  • قطع أنابيب النيتينول بدقة.
  • قطع الكوبالت والكروم للغرسات الطبية.
  • مواد البلاتين والإيريديوم للتطبيقات الدقيقة.
  • آلات موثوقة للمعادن فائقة الرقة.
  • توريد سبائك النيتينول والكوبالت والكروم.
  • أجهزة الليزر الدقيقة للدعامات الطبية.
  • مواد عالية الجودة للمعدات الطبية.
  • حلول القطع بالليزر للأنابيب السفلية.
  • آلات متخصصة للمكونات الجراحية.
  • قطع أنابيب النيتينول بدقة.
  • قطع الكوبالت والكروم للغرسات الطبية.
  • مواد البلاتين والإيريديوم للتطبيقات الدقيقة.
  • آلات موثوقة للمعادن فائقة الرقة.
  • توريد سبائك النيتينول والكوبالت والكروم.
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