FPC Cutting and Forming 01 – Precision Laser Processing by AQ-Laser
آلات الليزر عالية الدقة والمعدات واللوازم الطبية

قطع وتشكيل FPC 01

قطع وتشكيل FPC 01
 

FPC Cutting and Forming 01 – High-Precision Laser Solution

This is a cutting-edge laser system for processing flexible printed circuits (FPCs), perfect for medical and electronics applications, offering unmatched precision.

وصف:

The FPC Cutting and Forming 01 from AQ-Laser is an advanced laser processing system designed for high-precision micromachining of flexible printed circuits (FPCs) and related substrates. Tailored for industries like medical device manufacturing and consumer electronics, this system delivers clean, burr-free cuts and precise forming with minimal thermal impact. It supports a wide range of flexible materials, including polyimide (PI), PET, and FCCL, enabling intricate circuit designs and high-density interconnects (HDI). Equipped with automated features such as precise positioning and focusing, it ensures efficient, high-quality production for complex electronic components.

الميزات الرئيسية:

  • Ultra-Precise Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
  • Broad Material Compatibility: Processes flexible substrates like polyimide (PI), PET, FCCL, coverlay, and rigid-flex boards with ease.
  • Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
  • Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
  • CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.

Certification and Standards:

Conforms to global standards for electronics manufacturing. Adheres to strict quality and safety regulations.

مواد

FPC (Flexible Printed Circuit):

  • Flexibility: Enables bending and folding for compact designs in medical and electronic devices.
  • Lightweight: Thin and low-mass material reduces device weight for enhanced portability.
  • High Reliability: Supports complex circuit layouts with excellent thermal and electrical stability.
  • Miniaturization: Ideal for high-density, small-scale applications in wearables and implants.

PET (Polyethylene Terephthalate):

  • Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
  • Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
  • Cost-Effective: Economical material for large-scale production of medical and electronic components.
  • Transparency: Ideal for optical applications in diagnostic and laboratory devices.

PI (Polyimide):

  • High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
  • Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
  • Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
  • Flexibility: Supports intricate designs in compact, high-performance electronic devices.

Copper Foil:

  • Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
  • Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
  • Thin and Lightweight: Enables precision applications in electronics and medical sensors.
  • Malleability: Easily shaped for intricate designs in circuit boards and conductive components.

Aluminum Foil:

  • Lightweight: Low density reduces overall weight in medical and industrial applications.
  • Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
  • High Conductivity: Supports efficient electrical and thermal performance in electronic components.
  • Cost-Effective: Affordable material for large-scale production of precision parts.
طلب
  • High-precision cutting and forming of FPCs for medical devices, wearables, and consumer electronics.
  • Contour cutting, drilling, and marking of flexible and rigid-flex circuit boards.
  • Processing of cover films, adhesives, and EMI shielding films for compact electronic designs.
  • Suitable for high-density interconnect (HDI) designs in telecommunications and automotive applications.
تحديد
  • Laser Type: High-performance UV laser
  • Cutting Accuracy: ≤±10μm
  • Cutting Seam Width: 15–30μm
  • Material Compatibility: Polyimide (PI), PET, FCCL, coverlay, rigid-flex boards
  • Processing Capabilities: Contour cutting, drilling, marking, and forming
  • Automation: Automatic positioning, focusing, and feeding systems
  • Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats
سلع مماثلة

عزز إنتاجيتك اليوم

نحن على استعداد لتزويدك بعينة مجانية من أي من منتجاتنا

أو اتصل: +971505440730
  • أجهزة الليزر الدقيقة للدعامات الطبية.
  • مواد عالية الجودة للمعدات الطبية.
  • حلول القطع بالليزر للأنابيب السفلية.
  • آلات متخصصة للمكونات الجراحية.
  • قطع أنابيب النيتينول بدقة.
  • قطع الكوبالت والكروم للغرسات الطبية.
  • مواد البلاتين والإيريديوم للتطبيقات الدقيقة.
  • آلات موثوقة للمعادن فائقة الرقة.
  • توريد سبائك النيتينول والكوبالت والكروم.
  • أجهزة الليزر الدقيقة للدعامات الطبية.
  • مواد عالية الجودة للمعدات الطبية.
  • حلول القطع بالليزر للأنابيب السفلية.
  • آلات متخصصة للمكونات الجراحية.
  • قطع أنابيب النيتينول بدقة.
  • قطع الكوبالت والكروم للغرسات الطبية.
  • مواد البلاتين والإيريديوم للتطبيقات الدقيقة.
  • آلات موثوقة للمعادن فائقة الرقة.
  • توريد سبائك النيتينول والكوبالت والكروم.
الكتالوج شاهد كل شيء القائمة

نستخدم ملفات تعريف الارتباط لتحليل الأحداث على موقعنا. بمواصلة تصفح الموقع، فإنك توافق على شروط الاستخدام.

هل تحتاج إلى مساعدة؟

ماذا تريد؟ على سبيل المثال,القطع بالليزر