قطع وتشكيل FPC 04
FPC Cutting and Forming 04 – Precision Laser Micromachining for Flexible Electronic Substrates
FPC Cutting and Forming 04 is a high-precision laser micromachining process designed to create intricate and durable components from Flexible Printed Circuits (FPCs) for medical and electronic applications. Utilizing advanced UV laser technology, this process delivers exceptional accuracy, smooth finishes, and burr-free edges. Crafted from composite structures such as polyimide (PI), PET, and copper-clad laminates, the resulting components offer excellent flexibility, thermal stability, and electrical reliability, making them ideal for medical sensors, wearable devices, and precision electronics. The laser-cut design ensures clean cuts and complex patterns, optimizing performance in demanding environments. Tailored for high-precision applications, this process meets the rigorous standards of modern healthcare and electronics manufacturing.
الميزات الرئيسية:
- Ultra-Precise Cutting: Seam width of 15–30 µm with machining accuracy of ≤±10 µm for intricate circuit designs.
- Burr-Free Edges: Smooth surfaces ensure reliable performance and safe integration in sensitive applications.
- High Flexibility: Enables bending and folding for compact designs in medical and electronic devices.
- Minimal Heat-Affected Zone: UV laser technology minimizes thermal damage for enhanced component integrity.
- Composite Versatility: Compatible with FPC, PET, PI, copper foil, and aluminum foil substrates.
- معالجة فعالة: Direct-drive XY precision motion platform ensures high efficiency and consistent quality.
Certification and Standards:
Certified under ISO 9001 and IATF 16949 for quality management. Compliant with CE and FDA regulations for medical device safety and efficacy.
FPC (Flexible Printed Circuit):
- Flexibility: Enables bending and folding for compact designs in medical and electronic devices.
- Lightweight: Thin and low-mass material reduces device weight for enhanced portability.
- High Reliability: Supports complex circuit layouts with excellent thermal and electrical stability.
- Miniaturization: Ideal for high-density, small-scale applications in wearables and implants.
PET (Polyethylene Terephthalate):
- Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
- Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
- Cost-Effective: Economical material for large-scale production of medical and electronic components.
- Transparency: Ideal for optical applications in diagnostic and laboratory devices.
PI (Polyimide):
- High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
- Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
- Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
- Flexibility: Supports intricate designs in compact, high-performance electronic devices.
Copper Foil:
- Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
- Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
- Thin and Lightweight: Enables precision applications in electronics and medical sensors.
- Malleability: Easily shaped for intricate designs in circuit boards and conductive components.
Aluminum Foil:
- Lightweight: Low density reduces overall weight in medical and industrial applications.
- Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
- High Conductivity: Supports efficient electrical and thermal performance in electronic components.
- Cost-Effective: Affordable material for large-scale production of precision parts.
- Medical Sensors: Produces flexible components for wearable and implantable medical devices.
- Flexible Circuits: Creates intricate layouts for consumer electronics and diagnostic systems.
- Precision Electronics: Supports cutting of FPC substrates for high-density electronic applications.
- Diagnostic Equipment: Used in high-precision substrates for imaging and laboratory devices.
- Medical Device Manufacturing: Incorporated in the production of advanced flexible electronic components.
- Material: Flexible Printed Circuits (e.g., Polyimide (PI), PET, Copper Foil, Aluminum Foil)
- Thickness: 0.025–0.5 mm
- Cutting Seam Width: 15–30 µm
- Machining Accuracy: ≤±10 µm
- Surface Roughness: Ra <0.2 µm
- Manufacturing Process: UV laser micromachining with direct-drive XY motion platform
- Operating Temperature: -20°C to 300°C, suitable for high-heat applications
- Degradation: Non-degradable, designed for long-term stability
