آلة قطع ليزر الأشعة فوق البنفسجية AQS-PCB-4035 للوحات الدوائر المطبوعة الدقيقة
- Table size (mm): 400х350
- WT: 0~1.0±0.02 mm
- Materials: FPC&PCB&PET&PI&copper foil&aluminum foil&carbon fiber&glass fiber&composite&ceramic and other materials;
- Source type: UV fiber laser
- Option:
Scope of application
تقسيم وحفر PCB بالليزر؛ تقطيع FPC لوحدة التعرف على الكاميرا وبصمات الأصابع؛ فتح نافذة غطاء الفيلم وكشف اللوحة الصلبة المرنة وتشذيبها؛ صفائح الفولاذ السيليكونية والنقش على السيراميك؛ مادة مركبة رقيقة للغاية ورقائق النحاس ورقائق الألومنيوم وألياف الكربون والألياف الزجاجية وPET وPI والقطع والتشكيل بالليزر.
High finishing
- Cutting seam width: 15~30um
- High machining accuracy: ≤±10um
- Good incision quality: smooth incision & small heat affected zone & no burrs
- Size refinement: minimum product size 50um
Strong adaptability
- Possess the ability of laser cutting, drilling, scribing, blind engraving and other fine processing technology of plane & regular surface instruments
- Can process various materials such as FPC&PCB&PET&PI&copper foil&aluminum foil&carbon fiber&glass fiber&composite&ceramic
- Provide self-developed direct-drive XY superimposed & split-type fixed gantry precision motion platform & automatic loading and unloading system options
- Provide bilateral CCD visual positioning pre-scan & automatic target positioning function
- Equipped with precision vacuum adsorption fixture & dust removal piping system
- Equipped with self-developed laser micromachining 2D & 2.5D CAM software system
Flexible design
- Follow the ergonomic design concept, exquisite and concise
- Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
- Support forward innovative design from component level to system level
- Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface
Technical certification
- THIS
- ISO9001
- IATF16949
Sample Display
مواد
-
Processing Materials:
- FPC (Flexible Printed Circuit)
- PCB (Printed Circuit Board)
- PET (Polyethylene Terephthalate)
- PI (Polyimide)
- Copper foil
- Aluminum foil
- Carbon fiber
- Glass fiber
- Composite materials
- Ceramic and others
-
Laser Specifications:
- UV Fiber Laser with wavelength 355±5nm
- Power Options: 10W & 15W (nanosecond and picosecond)
- Cutting Seam Width: 15~30μm
- Material Wall Thickness: 0~1.0±0.02mm
طلب
Scope of Use
- Laser splitting and drilling of PCBs
- Processing camera and fingerprint recognition modules
- Cover film window opening, flex-rigid board uncovering, and trimming
- Scribing silicon steel sheets and ceramics
- Laser cutting and forming of ultra-thin composite materials, including:
- Copper and aluminum foil
- Carbon and glass fiber
- PET and PI
Processing Capabilities
- High machining accuracy: ≤±10μm
- Smooth incision with minimal heat-affected zone and no burrs
- Minimum product size: 50μm
Industries Served
- Electronics manufacturing
- Semiconductor industry
- Flexible and rigid PCB production
تحديد
Performance and Efficiency
Maximum Operating Speeds:
- X, Y1, Y2 Axes: 500mm/s
- Z Axis: 50mm/s
Positioning Accuracy:
- ±3μm (X, Y1, Y2, Z)
Repeatability:
- ±1μm (X, Y1, Y2, Z)
Advanced Features
- Self-developed XY motion platform and split-type fixed gantry design
- Optional automatic loading and unloading system
- Bilateral CCD visual positioning with pre-scan and automatic target alignment
- Precision vacuum adsorption fixture and integrated dust removal piping system
Certified Quality
- ISO9001
- IATF16949
Design Excellence
- Compact, ergonomic design
- Flexible combination of hardware and software for personalized production
- Intelligent management with an intuitive user interface
- Self-developed 2D and 2.5D CAM software system
