آلة قطع ألياف الليزر AQS-PCB-6080 لركيزة PCB الدقيقة
- Table size (mm): 600х800
- WT: 0~2.0±0.02 mm
- Materials: PCB aluminum substrate & copper substrate & ceramic substrate and other materials;
- Source type: Fiber
- Option:
Scope of application
قطع وحفر وتقطيع ونقش وتصنيع بالليزر لألواح الدوائر المطبوعة الدقيقة المصنوعة من الألومنيوم والنحاس والسيراميك.
High finishing
- Cutting seam width: 20~40um
- High machining accuracy: ≤±10um
- Good incision quality: smooth incision & small heat-affected zone & few burrs
- Size refinement: minimum product size 100um
Strong adaptability
- Possess the ability of fine processing technology such as PCB substrate laser cutting, drilling, scribing, etc.
- Can process various materials such as PCB aluminum substrate & copper substrate & ceramic substrate
- Equipped with self-developed direct-drive mobile double-drive precision motion platform, granite platform & sealed shafting configuration
- Provide optional functions such as double station & visual positioning & automatic loading & unloading system & etc.
- Equipped with self-developed long & short focal length sharp & flat fine laser cutting head
- Equipped with customized vacuum adsorption fixture & slag dust separation collection module & dust removal pipeline system & safety explosion-proof treatment system
- Equipped with self-developed laser micromachining 2D&2.5D&CAM software system
Flexible design
- Follow the ergonomic design concept, exquisite and concise
- Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
- Support forward innovative design from component level to system level
- Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface
Technical certification
- THIS
- ISO9001
- IATF16949
Sample display
مواد
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Processing Materials:
- PCB aluminum substrate
- PCB copper substrate
- Ceramic substrate
- Other related materials
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Laser Specifications:
- Fiber-optic laser with wavelength 1030~1070±10nm
- Power Options: CW1000W, CW2000W, QCW150W, QCW450W, QCW750W
- Cutting Seam Width: 20~40μm
- Material Wall Thickness: 0~2.0±0.02 mm
طلب
Scope of Use
Precision laser micromachining for:
- Cutting, drilling, slotting, and scribing PCB substrates
- Processing aluminum, copper, and ceramic substrates
- Applications in semiconductor integrated circuits and precision PCB manufacturing
Processing Capabilities
- High machining accuracy: ≤±10μm
- Smooth incision with minimal heat-affected zone and few burrs
- Minimum product size: 100μm
Industries Served
- Electronics manufacturing
- Semiconductor industry
- PCB production and prototyping
تحديد
Performance and Efficiency
Maximum Operating Speeds:
- X, Y1, Y2 Axes: 500mm/s
- Z Axis: 50mm/s
Positioning Accuracy:
- ±3μm (X, Y1, Y2)
- ±5μm (Z)
Repeatability:
- ±1μm (X, Y1, Y2)
- ±3μm (Z)
Advanced Features
- Double station and visual positioning options
- Automatic loading and unloading system
- Customized vacuum adsorption fixture
- Slag and dust collection module with dust removal pipeline system
- Long and short focal length laser cutting head with sharp and flat nose options
Certified Quality
- ISO9001
- IATF16949
Design Excellence
- Ergonomic and compact design
- Self-developed 2D, 2.5D, and CAM software system for flexible production
- Intuitive interface with customizable software and hardware configurations
- Integrated safety explosion-proof treatment system
