FPC Cutting and Forming 02 – Precision Laser Processing by AQ-Laser
آلات الليزر عالية الدقة والمعدات واللوازم الطبية

قطع وتشكيل FPC 02

FPC Cutting and Forming 02
 

FPC Cutting and Forming 02 – Precision Laser Processing

This is advanced laser cutting and forming for flexible printed circuits (FPCs), ideal for high-precision electronics manufacturing, delivering exceptional accuracy and efficiency.

The FPC Cutting and Forming 02 system from AQ-Laser is designed for precision micromachining of flexible printed circuits (FPCs), cover films, and other substrates used in electronics manufacturing. Leveraging state-of-the-art laser technology, this system ensures clean, burr-free cuts and intricate forming with minimal thermal impact. It is tailored for industries requiring high accuracy, such as medical device production, semiconductor manufacturing, and consumer electronics. The system supports a variety of materials, including polyimide (PI), PET, and composite substrates, making it versatile for complex circuit designs and high-density interconnects (HDI). With automated features like precise positioning and cutting, it streamlines production processes while maintaining superior quality.

الميزات الرئيسية:

  • Micron-Level Precision: Achieves cutting accuracy of ≤±10μm with seam widths of 15–30μm for intricate, burr-free designs.
  • تنوع المواد: Processes flexible materials like polyimide (PI), PET, and composite substrates, including FCCL, coverlay, and rigid-flex boards.
  • Minimal Thermal Impact: Utilizes advanced UV laser technology to reduce heat-affected zones, ensuring material integrity.
  • Automated Processing: Features automatic positioning and focusing systems for high-efficiency production.
  • CleanCut Technology: Delivers carbonization-free edges for superior technical cleanliness and reliability.

Certification and Standards:

Meets industry standards for precision electronics manufacturing. Compliant with international quality and safety regulations.

مواد

FPC (Flexible Printed Circuit):

  • Flexibility: Enables bending and folding for compact designs in medical and electronic devices.
  • Lightweight: Thin and low-mass material reduces device weight for enhanced portability.
  • High Reliability: Supports complex circuit layouts with excellent thermal and electrical stability.
  • Miniaturization: Ideal for high-density, small-scale applications in wearables and implants.

PET (Polyethylene Terephthalate):

  • Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
  • Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
  • Cost-Effective: Economical material for large-scale production of medical and electronic components.
  • Transparency: Ideal for optical applications in diagnostic and laboratory devices.

PI (Polyimide):

  • High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
  • Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
  • Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
  • Flexibility: Supports intricate designs in compact, high-performance electronic devices.

Copper Foil:

  • Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
  • Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
  • Thin and Lightweight: Enables precision applications in electronics and medical sensors.
  • Malleability: Easily shaped for intricate designs in circuit boards and conductive components.

Aluminum Foil:

  • Lightweight: Low density reduces overall weight in medical and industrial applications.
  • Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
  • High Conductivity: Supports efficient electrical and thermal performance in electronic components.
  • Cost-Effective: Affordable material for large-scale production of precision parts.
طلب
  • Precision cutting and forming of FPCs for medical devices, wearables, and consumer electronics.
  • Contour cutting, drilling, and marking of flexible and rigid-flex circuit boards.
  • Processing of cover films, adhesives, and EMI shielding films for compact, high-performance electronics.
  • Ideal for high-density interconnect (HDI) designs and complex circuit geometries in telecommunications and automotive industries.
تحديد
  • Laser Type: High-performance UV laser
  • Cutting Accuracy: ≤±10μm
  • Cutting Seam Width: 15–30μm
  • Material Compatibility: Polyimide (PI), PET, FCCL, coverlay, rigid-flex boards
  • Processing Capabilities: Contour cutting, drilling, marking, and forming
  • Automation: Automatic positioning, focusing, and feeding systems
  • Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats
سلع مماثلة

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  • توريد سبائك النيتينول والكوبالت والكروم.
  • أجهزة الليزر الدقيقة للدعامات الطبية.
  • مواد عالية الجودة للمعدات الطبية.
  • حلول القطع بالليزر للأنابيب السفلية.
  • آلات متخصصة للمكونات الجراحية.
  • قطع أنابيب النيتينول بدقة.
  • قطع الكوبالت والكروم للغرسات الطبية.
  • مواد البلاتين والإيريديوم للتطبيقات الدقيقة.
  • آلات موثوقة للمعادن فائقة الرقة.
  • توريد سبائك النيتينول والكوبالت والكروم.
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