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Chip Cutting and Forming – Precision Laser Solution

This is an advanced laser system for micromachining semiconductor chips, ideal for electronics and medical applications, delivering unmatched accuracy.

The Chip Cutting and Forming system from AQ-Laser is a state-of-the-art laser processing solution designed for high-precision micromachining of semiconductor chips and related substrates. Tailored for industries such as semiconductor manufacturing, medical device production, and consumer electronics, this system ensures clean, burr-free cuts and precise forming with minimal thermal impact. It supports a variety of materials, including silicon, sapphire, and ceramic substrates, enabling intricate chip designs and high-density interconnects (HDI). Equipped with automated features like precise positioning and focusing, it optimizes production efficiency while maintaining exceptional quality for advanced electronic components.

الميزات الرئيسية:

Ultra-Precise Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free chip designs.
تنوع المواد: Processes materials like silicon, sapphire, diamond, and ceramic substrates with ease.
Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.

Certification and Standards:

Certified to ISO9001 and IATF16949 standards, ensuring consistent quality for electronics and automotive applications. Additionally meets IPC-6012 standards for printed circuit board performance, complies with UL certification for safety in electronic components, and adheres to RoHS and REACH directives for environmental sustainability and hazardous substance control.

مواد

Aluminum Substrate:

Excellent Thermal Conductivity: Efficiently dissipates heat, ideal for high-power electronics like LED lighting and medical imaging devices.
Lightweight: Reduces overall device weight, enhancing portability for applications in wearables and compact electronics.
Cost-Effective: Offers a balance of performance and affordability, suitable for large-scale electronics manufacturing.
Corrosion Resistance: Resists environmental degradation, ensuring durability in harsh conditions.
Mechanical Strength: Provides robust support for circuit components, maintaining structural integrity under stress.
Recyclability: Environmentally friendly, supporting sustainable manufacturing practices.

Copper Substrate:

Superior Electrical Conductivity: Ensures efficient signal transmission, critical for high-frequency 5G antennas and power electronics.
High Thermal Conductivity: Effectively manages heat dissipation, ideal for high-performance PCBs and medical devices.
Ductility: Allows precise forming and shaping, enabling intricate designs for compact electronic assemblies.
Durability: Resists wear and tear, providing long-term reliability in demanding applications.
Solderability: Facilitates strong, reliable connections in circuit assembly, enhancing manufacturing efficiency.
High-Density Interconnect Support: Enables complex, high-density circuit designs for advanced electronics.

Ceramic Substrate:

Exceptional Thermal Stability: Withstands extreme temperatures, ideal for high-power and high-frequency electronics like RF modules.
Superior Electrical Insulation: Prevents unwanted conductivity, ensuring reliable performance in sensitive medical and telecom devices.
High Mechanical Strength: Maintains structural integrity under stress, supporting precision manufacturing of complex designs.
Chemical Inertness: Resists corrosion from chemicals and environmental factors, ensuring long-term reliability.
Low Dielectric Loss: Enhances signal integrity, making it perfect for high-frequency applications like 5G and radar systems.
Biocompatibility: Suitable for medical implants and diagnostic equipment due to its non-reactive properties.

طلب

High-precision cutting and forming of semiconductor chips for medical devices and consumer electronics.
Wafer dicing, drilling, and marking for high-performance integrated circuits (ICs).
Processing of ceramic and sapphire substrates for optoelectronics and high-frequency applications.
Suitable for high-density interconnect (HDI) designs in telecommunications and automotive industries.

تحديد