Máquina de corte láser UV AQS-PCB-4035 para PCB de precisión
- Table size (mm): 400х350
- WT: 0~1.0±0.02 mm
- Materials: FPC&PCB&PET&PI&copper foil&aluminum foil&carbon fiber&glass fiber&composite&ceramic and other materials;
- Source type: UV fiber laser
- Option:
Scope of application
División y perforación láser de PCB; corte longitudinal de FPC para módulos de reconocimiento de huellas dactilares y cámaras; apertura de ventana de película de cubierta y descubrimiento y recorte de placa flexible y rígida; trazado de láminas de acero al silicio y cerámica; corte y conformado por láser de material compuesto ultrafino y láminas de cobre y aluminio y fibra de carbono y fibra de vidrio y PET y PI.
High finishing
- Cutting seam width: 15~30um
- High machining accuracy: ≤±10um
- Good incision quality: smooth incision & small heat affected zone & no burrs
- Size refinement: minimum product size 50um
Strong adaptability
- Possess the ability of laser cutting, drilling, scribing, blind engraving and other fine processing technology of plane & regular surface instruments
- Can process various materials such as FPC&PCB&PET&PI&copper foil&aluminum foil&carbon fiber&glass fiber&composite&ceramic
- Provide self-developed direct-drive XY superimposed & split-type fixed gantry precision motion platform & automatic loading and unloading system options
- Provide bilateral CCD visual positioning pre-scan & automatic target positioning function
- Equipped with precision vacuum adsorption fixture & dust removal piping system
- Equipped with self-developed laser micromachining 2D & 2.5D CAM software system
Flexible design
- Follow the ergonomic design concept, exquisite and concise
- Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
- Support forward innovative design from component level to system level
- Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface
Technical certification
- THIS
- ISO9001
- IATF16949
Sample Display
Materiales
-
Processing Materials:
- FPC (Flexible Printed Circuit)
- PCB (Printed Circuit Board)
- PET (Polyethylene Terephthalate)
- PI (Polyimide)
- Copper foil
- Aluminum foil
- Carbon fiber
- Glass fiber
- Composite materials
- Ceramic and others
-
Laser Specifications:
- UV Fiber Laser with wavelength 355±5nm
- Power Options: 10W & 15W (nanosecond and picosecond)
- Cutting Seam Width: 15~30μm
- Material Wall Thickness: 0~1.0±0.02mm
Solicitud
Scope of Use
- Laser splitting and drilling of PCBs
- Processing camera and fingerprint recognition modules
- Cover film window opening, flex-rigid board uncovering, and trimming
- Scribing silicon steel sheets and ceramics
- Laser cutting and forming of ultra-thin composite materials, including:
- Copper and aluminum foil
- Carbon and glass fiber
- PET and PI
Processing Capabilities
- High machining accuracy: ≤±10μm
- Smooth incision with minimal heat-affected zone and no burrs
- Minimum product size: 50μm
Industries Served
- Electronics manufacturing
- Semiconductor industry
- Flexible and rigid PCB production
Presupuesto
Performance and Efficiency
Maximum Operating Speeds:
- X, Y1, Y2 Axes: 500mm/s
- Z Axis: 50mm/s
Positioning Accuracy:
- ±3μm (X, Y1, Y2, Z)
Repeatability:
- ±1μm (X, Y1, Y2, Z)
Advanced Features
- Self-developed XY motion platform and split-type fixed gantry design
- Optional automatic loading and unloading system
- Bilateral CCD visual positioning with pre-scan and automatic target alignment
- Precision vacuum adsorption fixture and integrated dust removal piping system
Certified Quality
- ISO9001
- IATF16949
Design Excellence
- Compact, ergonomic design
- Flexible combination of hardware and software for personalized production
- Intelligent management with an intuitive user interface
- Self-developed 2D and 2.5D CAM software system
