Perçage de céramique en oxyde de silicium WT0,2 mm
- High Accuracy: Drilling precision of ≤±10µm ensures consistent quality.
- Smooth Finish: Minimal burrs and edge chipping (<15µm) for a flawless surface.
- Adaptability: Compatible with 2D, 2.5D, and 3D drilling patterns.
- Eco-Friendly: Designed for minimal material waste and energy-efficient production.
Description du produit
The Silicon Oxide Ceramics WT0.2mm Drilling is a precision drilling solution designed for creating ultra-fine holes in hard and brittle materials. Utilizing advanced laser micromachining technology, this process ensures exceptional accuracy, smooth edges, and minimal thermal damage. With a drilling diameter of 0.2mm, it is ideal for applications requiring high precision and reliability in industries such as electronics, optics, and medical devices.
Caractéristiques principales :
- Ultra-High Precision: Drilling diameter of 0.2mm ensures flawless results.
- Minimal Thermal Impact: Small heat-affected zone and smooth incision quality.
- Exceptional Durability: Silicon oxide ceramics offer superior hardness and thermal stability.
- Versatilité: Capable of drilling in various hard and brittle materials.
- Customizable: Supports various shapes, sizes, and patterns to meet specific requirements.
-
Primary Material: Silicon oxide ceramics (SiO₂) – known for high hardness, thermal stability, and electrical insulation.
-
Compatible Materials: Alumina, zirconia, silicon nitride, sapphire, and other high-performance ceramics.
Silicon Oxide Ceramics WT0.2mm Drilling is widely used in the following industries:
-
Electronics: Precision drilling for semiconductor wafers and microelectronics.
-
Dispositifs médicaux : Surgical tools, implants, and diagnostic equipment.
-
Optics: Creating fine holes in lenses and optical components.
-
Industrial Tools: High-precision drilling for cutting and forming tools.
-
Research and Development: Prototyping and testing of advanced materials.
