Категория : Substrats pour la fabrication électronique
20 items-
Procédé de formation de sonde plaquée or
La machine de découpe laser UV est un équipement hautement spécialisé conçu pour les applications de micro-usinage laser de précision telles que le fractionnement laser de PCB. -
Découpage du film
La découpe de film est une solution de micro-usinage laser de haute précision conçue pour créer des coupes complexes et durables sur divers matériaux de film. -
Découpe et formage de PCB et de fibre de verre
La découpe et le formage de PCB et de fibre de verre sont une solution de micro-usinage laser de haute précision conçue pour créer des coupes complexes et durables sur des matériaux PCB (circuits imprimés) et en fibre de verre. -
Découpe et formage FPC 04
Le FPC Cutting and Forming 04 est une solution de micro-usinage laser de haute précision conçue pour créer des coupes complexes et durables sur des circuits imprimés flexibles (FPC). -
FPC Cutting and Forming 03
The FPC Cutting and Forming 03 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 02
The FPC Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 01
The FPC Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
COF Cutting and Forming 02
The COF Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
COF Cutting and Forming 01
The COF Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
5G Copper Foil Antenna Cutting and Forming
The 5G Copper Foil Antenna Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on 5G copper foil antennas. -
Chip Cutting and Forming
The Chip Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on chips. -
Copper Substrate Cutting and Forming
The Copper Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on copper substrates. -
Ceramic Substrate Cutting and Forming
The Ceramic Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on ceramic substrates. -
Ceramic Substrate Scribing
The Ceramic Substrate Scribing is a high-precision laser micromachining solution designed for creating intricate and durable scribing on ceramic substrates. -
Aluminum Substrate Cut Quality
The Aluminum Substrate Cut Quality is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 04
The Aluminum Substrate Cutting and Forming 04 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 03
The Aluminum Substrate Cutting and Forming 03 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 02
The Aluminum Substrate Cutting and Forming 02 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.
