Aluminum Substrate Cutting and Forming 01
- High Adaptability: Compatible with various PCB materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Personnalisable : prend en charge les configurations personnalisées et la production intelligente.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Description du produit
Le Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. Utilizing advanced fiber laser micromachining technology, this aluminum substrate ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and durable PCB substrate solutions.
Caractéristiques principales :
- Haute précision : Précision de coupe ≤±10µm.
- Finition lisse : Smooth incision with a seam width of 20~40µm and minimal heat-affected zone.
- Traitement efficace : Direct-drive mobile double-drive system for one-time cutting.
- Polyvalence des matériaux : Compatible with aluminum substrates and other PCB materials.
- Technologie avancée : Fabriqué à l'aide de logiciels de FAO 2D et 2,5D.
Matériels
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Aluminum Substrate
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Copper Substrate
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Ceramic Substrate
Application
Le Aluminum Substrate Cutting and Forming 01 is widely used in the industry for:
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PCB manufacturing
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Precision electronics
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Industrial applications
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Surface treatment applications
