COF Cutting and Forming 01
- High Adaptability: Compatible with various materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Personnalisable : prend en charge les configurations personnalisées et la production intelligente.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Description du produit
Le COF Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. Utilizing advanced UV laser technology, this process ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and complex COF processing.
Caractéristiques principales :
- Haute précision : Précision de coupe ≤±10µm.
- Finition lisse : Smooth cuts with a seam width of 15~30µm and minimal heat-affected zone.
- Traitement efficace : Direct-drive XY precision motion platform for one-time cutting.
- Polyvalence des matériaux : Compatible with COF substrates and other materials.
- Technologie avancée : Fabriqué à l'aide de logiciels de FAO 2D et 2,5D.
Matériels
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COF Substrates
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PET
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PI
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Copper Foil
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Aluminum Foil
Application
Le COF Cutting and Forming 01 is widely used in the industry for:
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COF manufacturing
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Precision electronics
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Industrial applications
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Surface treatment applications
