Découpe et formage de PCB et de fibre de verre
- High Adaptability: Compatible with various materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Customizable: Supports personalized configurations and intelligent production.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Description du produit
Le Découpe et formage de PCB et de fibre de verre is a high-precision laser micromachining solution designed for creating intricate and durable cuts on PCB (Printed Circuit Board) and fiberglass materials. Utilizing advanced UV laser technology, this process ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and complex PCB and fiberglass processing.
Caractéristiques principales :
- High Precision: Cutting accuracy of ≤±10µm.
- Smooth Finish: Smooth cuts with a seam width of 15~30µm and minimal heat-affected zone.
- Efficient Processing: Direct-drive XY precision motion platform for one-time cutting.
- Material Versatility: Compatible with PCB, fiberglass, and other materials.
- Advanced Technology: Manufactured using 2D and 2.5D CAM software.
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PCB
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Fiberglass
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PET
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PI
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Copper Foil
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Aluminum Foil
Le Découpe et formage de PCB et de fibre de verre is widely used in the industry for:
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PCB manufacturing
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Precision electronics
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Industrial applications
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Surface treatment applications