Découpe et formage de PCB et de fibre de verre
- High Adaptability: Compatible with various materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Personnalisable : prend en charge les configurations personnalisées et la production intelligente.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Description du produit
Le Découpe et formage de PCB et de fibre de verre is a high-precision laser micromachining solution designed for creating intricate and durable cuts on PCB (Printed Circuit Board) and fiberglass materials. Utilizing advanced UV laser technology, this process ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and complex PCB and fiberglass processing.
Caractéristiques principales :
- Haute précision : Précision de coupe ≤±10µm.
- Finition lisse : Smooth cuts with a seam width of 15~30µm and minimal heat-affected zone.
- Traitement efficace : Direct-drive XY precision motion platform for one-time cutting.
- Polyvalence des matériaux : Compatible with PCB, fiberglass, and other materials.
- Technologie avancée : Fabriqué à l'aide de logiciels de FAO 2D et 2,5D.
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PCB
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Fiberglass
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PET
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PI
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Copper Foil
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Aluminum Foil
Le Découpe et formage de PCB et de fibre de verre is widely used in the industry for:
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PCB manufacturing
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Precision electronics
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Industrial applications
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Surface treatment applications