Substrats pour la fabrication électronique
20 articles-
Découpe et Formage de Substrats en Aluminium 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Formage laser de substrats en cuivre amincis WT0.3 mm
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.