מצעים לייצור אלקטרוניקה
20 itemsCustomized forming of Substrates for Electronics Manufacturing according to your specifications
At AQ-Laser, you can order Substrates for Electronics Manufacturing according to your individual drawings and other requirements. We are a manufacturer of laser machines for high-precision metal cutting and microprocessing, carrying out custom laser cutting projects for the medical, micro-engineering, and related industries.
What type of Substrates for Electronics Manufacturing do we offer?
- SUS304 substrate perforated / slit
- 0.1 mm Aluminum Nitride ceramic substrate
- High thermal conductivity ceramic substrate
- NiFe substrate for magnetic devices
- SiC substrate for power electronics
- Metal-oxide substrate structure
- Sapphire substrate for LEDs
- Glass substrate for microdevices
Why choose us?
Individual approach — we work according to your drawings, taking into account all technological requirements and details.
Own production and equipment — all work is performed on our high-precision laser machines, ensuring quality control at every stage.
Accuracy and compliance with tolerances — we are experienced in working with micrometer-scale sizes and strict requirements typical for medical products.
Meeting deadlines — we understand how important delivery times are for our clients and strictly adhere to them.
Delivery across the United States and worldwide.
Quality assurance and support — quality control at every stage, rework and maintenance if necessary.
Confidentiality — your drawings and technical requirements are kept strictly confidential and protected by agreements.
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תהליך יצירת גשש מצופה זהב
מכונת חיתוך לייזר UV היא ציוד מיוחד ביותר המיועד ליישומי מיקרו-עיבוד שבבי מדויקים בלייזר, כגון פיצול לייזר של PCB. -
חיתוך סרטים
חיתוך הסרטים הוא פתרון מיקרו-מכאני בלייזר מדויק במיוחד, המיועד ליצירת חיתוכים מורכבים ועמידים על חומרי פילם שונים. -
חיתוך ועיצוב של PCB ופיברגלס
חיתוך ועיצוב של PCB ו-Fiberglass הוא פתרון מיקרו-עיבוד שבבי בלייזר מדויק במיוחד, המיועד ליצירת חיתוכים מורכבים ועמידים על PCB (מעגל מודפס) וחומרי פיברגלס. -
FPC Cutting and Forming 04
The FPC Cutting and Forming 04 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 03
The FPC Cutting and Forming 03 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
חיתוך ועיצוב FPC 02
The FPC Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 01
The FPC Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
COF Cutting and Forming 02
The COF Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
COF Cutting and Forming 01
The COF Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
5G Copper Foil Antenna Cutting and Forming
The 5G Copper Foil Antenna Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on 5G copper foil antennas. -
חיתוך ועיצוב שבבים
חיתוך ועיצוב שבבים הוא פתרון מיקרו-עיבוד שבבי בלייזר מדויק במיוחד, המיועד ליצירת חיתוכים מורכבים ועמידים על שבבים. -
Copper Substrate Cutting and Forming
The Copper Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on copper substrates. -
Ceramic Substrate Cutting and Forming
The Ceramic Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on ceramic substrates. -
שרבוט מצע קרמי
The Ceramic Substrate Scribing is a high-precision laser micromachining solution designed for creating intricate and durable scribing on ceramic substrates. -
Aluminum Substrate Cut
The Aluminum Substrate Cut Quality is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 04
The Aluminum Substrate Cutting and Forming 04 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 03
The Aluminum Substrate Cutting and Forming 03 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
חיתוך ועיצוב מצע אלומיניום 02
The Aluminum Substrate Cutting and Forming 02 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.