Ceramic Substrate Cutting and Forming
Ceramic Substrate Cutting and Forming – Precision Laser Solution
This is an advanced laser system for micromachining ceramic substrates, ideal for electronics and medical applications, delivering exceptional precision.
The Ceramic Substrate Cutting and Forming system from AQ-Laser is a cutting-edge laser processing solution designed for high-precision micromachining of ceramic substrates, such as alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). Tailored for industries like semiconductor manufacturing, medical device production, and telecommunications, this system ensures clean, burr-free cuts and precise forming with minimal thermal impact. It supports complex geometries and high-density interconnect (HDI) designs, making it perfect for applications requiring high thermal conductivity and electrical insulation. Equipped with automated features like precise positioning and focusing, it optimizes production efficiency while maintaining superior quality for advanced electronic components.
תכונות עיקריות:
- High-Precision Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
- רבגוניות חומרית: Processes ceramic substrates like alumina (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4) with ease.
- Low Thermal Impact: Advanced laser technology minimizes heat-affected zones, preserving material integrity.
- Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
- CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.
- High Corrosion Resistance: Supports durable ceramic materials resistant to chemical and environmental degradation.
Certification and Standards:
Certified to ISO9001 and IATF16949 standards, ensuring consistent quality for electronics and automotive applications. Compliant with CE marking and RoHS directives for safety and environmental sustainability.
Aluminum Substrate:
- Excellent Thermal Conductivity: Efficiently dissipates heat, ideal for high-power electronics like LED lighting and medical imaging devices.
- Lightweight: Reduces overall device weight, enhancing portability for applications in wearables and compact electronics.
- Cost-Effective: Offers a balance of performance and affordability, suitable for large-scale electronics manufacturing.
- Corrosion Resistance: Resists environmental degradation, ensuring durability in harsh conditions.
- Mechanical Strength: Provides robust support for circuit components, maintaining structural integrity under stress.
- Recyclability: Environmentally friendly, supporting sustainable manufacturing practices.
Copper Substrate:
- Superior Electrical Conductivity: Ensures efficient signal transmission, critical for high-frequency 5G antennas and power electronics.
- High Thermal Conductivity: Effectively manages heat dissipation, ideal for high-performance PCBs and medical devices.
- Ductility: Allows precise forming and shaping, enabling intricate designs for compact electronic assemblies.
- Durability: Resists wear and tear, providing long-term reliability in demanding applications.
- Solderability: Facilitates strong, reliable connections in circuit assembly, enhancing manufacturing efficiency.
- High-Density Interconnect Support: Enables complex, high-density circuit designs for advanced electronics.
Ceramic Substrate:
- Exceptional Thermal Stability: Withstands extreme temperatures, ideal for high-power and high-frequency electronics like RF modules.
- Superior Electrical Insulation: Prevents unwanted conductivity, ensuring reliable performance in sensitive medical and telecom devices.
- High Mechanical Strength: Maintains structural integrity under stress, supporting precision manufacturing of complex designs.
- Chemical Inertness: Resists corrosion from chemicals and environmental factors, ensuring long-term reliability.
- Low Dielectric Loss: Enhances signal integrity, making it perfect for high-frequency applications like 5G and radar systems.
- Biocompatibility: Suitable for medical implants and diagnostic equipment due to its non-reactive properties.
- High-precision cutting and forming of ceramic substrates for medical devices and high-frequency electronics.
- Drilling, scribing, and marking for power modules, LEDs, and RF components.
- Processing of alumina and aluminum nitride substrates for optoelectronics and telecommunications.
- Suitable for high-density interconnect (HDI) designs in aerospace and automotive applications.
- Laser Type: High-performance UV and CO2 lasers
- Cutting Accuracy: ≤±10μm
- Cutting Seam Width: 15–30μm
- Material Compatibility: Alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4)
- Processing Capabilities: Cutting, drilling, scribing, and forming
- Automation: Automatic positioning, focusing, and feeding systems
- Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats
