Customized forming of Hard and Brittle Devices according to your specifications

At AQ-Laser, you can order Hard and Brittle Devices according to your individual drawings and other requirements. We are a manufacturer of laser machines for high-precision metal cutting and microprocessing, carrying out custom laser cutting projects for the medical, micro-engineering, and related industries.

What type of Hard and Brittle Devices do we offer?

  • Glass cutting for micro-slots and holes
  • Piezoelectric ceramic device laser cutting
  • Quartz crystal structure machining
  • Alumina ceramic microstructure forming
  • Hard brittle material perforated sheet cutting
  • Silicon wafer laser patterning
  • Diamond substrate micro-machining
  • Glass ceramic optical component cutting

Why choose us?

Individual approach — we work according to your drawings, taking into account all technological requirements and details.

Own production and equipment — all work is performed on our high-precision laser machines, ensuring quality control at every stage.

Accuracy and compliance with tolerances — we are experienced in working with micrometer-scale sizes and strict requirements typical for medical products.

Meeting deadlines — we understand how important delivery times are for our clients and strictly adhere to them.

Delivery across the United States and worldwide.

Quality assurance and support — quality control at every stage, rework and maintenance if necessary.

Confidentiality — your drawings and technical requirements are kept strictly confidential and protected by agreements.