קרמיקה של תחמוצת סיליקון בקידוח משקל 0.2 מ"מ
Silicon Oxide Ceramics WT0.2mm Drilling – Precision Laser Solution
This is a high-precision laser drilling system for ultra-thin silicon oxide ceramics, ideal for electronics and medical applications, delivering exceptional accuracy.
The Silicon Oxide Ceramics WT0.2mm Drilling system from AQ-Laser is an advanced laser processing solution designed for high-precision micro-drilling of ultra-thin silicon oxide ceramic substrates with a thickness of 0.2mm. Tailored for industries such as semiconductor manufacturing, medical device production, and high-frequency electronics, this system delivers clean, burr-free micro-holes with minimal thermal impact. Optimized for hard and brittle silicon oxide ceramics, it enables intricate designs critical for high-performance applications like RF modules and medical sensors. Equipped with automated features such as precise positioning and focusing, it ensures efficient, high-quality production for advanced electronic components.
תכונות עיקריות:
- High-Precision Drilling: Achieves drilling accuracy of ≤±10μm for micro-holes in ultra-thin ceramics.
- Material Optimization: Processes 0.2mm silicon oxide ceramics with high hardness and brittleness.
- Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
- Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
- CleanCut Technology: Ensures burr-free and carbonization-free holes, enhancing technical cleanliness.
- High Corrosion Resistance: Supports durable ceramics resistant to chemical and environmental degradation.
Certification and Standards:
Certified to ISO9001 and IATF16949 standards, ensuring consistent quality for electronics and automotive applications. Compliant with CE marking and RoHS directives for safety and environmental sustainability.
Primary Material:
Silicon oxide ceramics (SiO₂) – highly durable, non-conductive materials known for their excellent thermal stability and chemical inertness. Widely used in electronics and medical applications, they support precise micromachining for high-performance components.
Compatible Materials:
- Alumina
- Zirconia
- Sapphire
- Silicon nitride
- Other high-performance ceramics
- High-precision drilling of silicon oxide ceramic substrates for medical sensors and high-frequency electronics.
- Micro-hole drilling for RF modules, power modules, and optoelectronic components.
- Processing of ultra-thin ceramics for semiconductor packaging and telecommunications.
- Suitable for high-density interconnect (HDI) designs in aerospace and medical applications.
- Laser Type: High-performance UV laser
- Drilling Accuracy: ≤±10μm
- Hole Diameter Range: 20–100μm
- Material Compatibility: Silicon oxide ceramics (0.2mm thickness)
- Processing Capabilities: Micro-hole drilling, scribing, and marking
- Automation: Automatic positioning, focusing, and feeding systems
- Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats