COF Cutting and Forming 01
COF Cutting and Forming 01 – Advanced Laser Processing
This is a high-precision laser system for chip-on-film (COF) substrates, ideal for electronics and medical applications, offering exceptional accuracy.
The COF Cutting and Forming 01 from AQ-Laser is an advanced laser processing system designed for high-precision micromachining of chip-on-film (COF) substrates and related materials. Tailored for industries such as medical device manufacturing, consumer electronics, and display production, this system delivers clean, burr-free cuts and precise forming with minimal thermal impact. It supports a variety of flexible materials, including polyimide (PI), PET, and FCCL, enabling intricate circuit designs and high-density interconnects (HDI). Equipped with automated features like precise positioning and focusing, it ensures efficient, high-quality production for complex electronic components.
תכונות עיקריות:
- Ultra-Precise Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
- רבגוניות חומרית: Processes flexible substrates like polyimide (PI), PET, FCCL, and coverlay with ease.
- Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
- Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
- CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.
Certification and Standards:
Conforms to global standards for electronics manufacturing. Adheres to strict quality and safety regulations.
COF Substrates:
- High Flexibility: Enables bending and folding without compromising electrical performance, ideal for compact and wearable devices.
- Miniaturization Support: Facilitates high-density interconnects (HDI) for intricate, space-saving circuit designs.
- Durability: Resists mechanical stress and environmental factors, ensuring long-term reliability in demanding applications.
- Thermal Stability: Maintains performance under high temperatures, suitable for advanced electronics and medical devices.
- Lightweight Design: Reduces overall device weight, enhancing portability in consumer and medical applications.
- Versatile Material Compatibility: Supports polyimide (PI), PET, and FCCL, allowing diverse manufacturing applications.
- Precision Processing: Compatible with advanced laser cutting and forming, delivering clean, burr-free edges for high-quality production.
PET (Polyethylene Terephthalate):
- Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
- Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
- Cost-Effective: Economical material for large-scale production of medical and electronic components.
- Transparency: Ideal for optical applications in diagnostic and laboratory devices.
PI (Polyimide):
- High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
- Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
- Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
- Flexibility: Supports intricate designs in compact, high-performance electronic devices.
Copper Foil:
- Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
- Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
- Thin and Lightweight: Enables precision applications in electronics and medical sensors.
- Malleability: Easily shaped for intricate designs in circuit boards and conductive components.
Aluminum Foil:
- Lightweight: Low density reduces overall weight in medical and industrial applications.
- Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
- High Conductivity: Supports efficient electrical and thermal performance in electronic components.
- Cost-Effective: Affordable material for large-scale production of precision parts.
- High-precision cutting and forming of COF substrates for medical devices, displays, and consumer electronics.
- Contour cutting, drilling, and marking of flexible circuit materials.
- Processing of cover films and adhesives for compact, high-performance electronics.
- Suitable for high-density interconnect (HDI) designs in telecommunications and wearable technology.
- Laser Type: High-performance UV laser
- Cutting Accuracy: ≤±10μm
- Cutting Seam Width: 15–30μm
- Material Compatibility: Polyimide (PI), PET, FCCL, coverlay
- Processing Capabilities: Contour cutting, drilling, marking, and forming
- Automation: Automatic positioning, focusing, and feeding systems
- Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats