מצעים לייצור אלקטרוניקה
20 items-
Aluminum Substrate Cutting and Forming 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
מצע נחושת דליל משקל 0.3 מ"מ עיצוב בלייזר
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.
