Riscagem de substrato cerâmico
- High Adaptability: Compatible with various PCB materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Personalizável: Suporta configurações personalizadas e produção inteligente.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Descrição do produto
O Riscagem de substrato cerâmico is a high-precision laser micromachining solution designed for creating intricate and durable scribing on ceramic substrates. Utilizing advanced fiber laser technology, this process ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and complex ceramic substrate processing.
Principais características:
- Alta precisão: Scribing accuracy of ≤±10µm.
- Acabamento liso: Smooth scribing with a seam width of 20~40µm and minimal heat-affected zone.
- Processamento eficiente: Direct-drive mobile double-drive system for one-time scribing.
- Versatilidade do material: Compatible with ceramic substrates and other PCB materials.
- Tecnologia avançada: Manufactured using 2D and 2.5D CAM software.
Materiais
-
Ceramic Substrate
-
Aluminum Substrate
-
Copper Substrate
Aplicativo
O Riscagem de substrato cerâmico is widely used in the industry for:
-
PCB manufacturing
-
Precision electronics
-
Industrial applications
-
Surface treatment applications
