Categoria: Substratos para Fabricação de Eletrônicos
20 items-
Corte e Conformação de Substrato de Alumínio 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Substrato de cobre diluído WT0,3 mm conformação a laser
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.