Substratos para Fabricação de Eletrônicos
20 itens-
Corte e Formação de Substratos de Alumínio 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Formação a laser de substratos de cobre afinados WT0.3 mm
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.