AQS-HB-6045 Laser cutting machine for precision hard and brittle materials
- Table size (mm): 300mm*300mm; (larger format requirements support customization)
- WT: 0~2.0±0.02 mm
- Materials: Alumina & Zirconia & Aluminum Nitride & Zirconium Nitride & Silicon Nitride & Diamond & Sapphire & Silicon & Germanium & Gallium Arsenide & Tungsten Steel, etc.;
- Source type: Fiber
- Option:
Scope of application
Laser micromachining of ceramics, sapphire, diamond, tungsten steel and other high hardness & high brittleness plane and regular surface instruments.
High finishing
- Cutting seam width: 15~30um
- High machining accuracy: ≤±10um
- Good incision quality: smooth incision & small heat-affected zone & few burrs & edge chipping <15um
- Size refinement: minimum product size 100um
Strong adaptability
- Possess the ability of fine processing technology such as laser cutting, drilling, slotting, scribing and so on for flat & curved instruments
- Machinable alumina & zirconia & aluminum nitride & silicon nitride & diamond & sapphire & silicon & gallium arsenide & tungsten steel and other materials
- Equipped with self-developed direct-drive mobile double-drive precision motion platform, granite platform, aluminum alloy & granite beam for selection
- Provide optional functions such as double station & visual positioning & automatic loading and unloading system & processing dynamic monitoring
- Equipped with self-developed long & short focal length sharp & flat fine laser cutting head
- Configure modular feed and dust ductwork
- Provide self-developed movable tension frame & fixed tension frame & vacuum adsorption & honeycomb panel and other fixture options
- Equipped with self-developed laser micromachining 2D & 2.5D & 3D CAM software system
Flexible design
- Follow the ergonomic design concept, exquisite and concise
- Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
- Support forward innovative design from component level to system level
- Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface
Technical certification
- THIS
- ISO9001
- IATF16949
Sample Display
Materials
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Processing Materials:
- Alumina
- Zirconia
- Aluminum Nitride
- Silicon Nitride
- Diamond
- Sapphire
- Silicon
- Germanium
- Gallium Arsenide
- Tungsten Steel
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Laser Specifications:
- Fiber-optic laser
- Wavelength: 1030~1070±10nm
- Power Options: CW1000W, QCW150W, QCW300W, QCW450W
- Cutting Seam Width: 15~30μm
- Material Wall Thickness: 0~2.0±0.02mm
Application
-
Scope of Use:
- Laser micromachining of high-hardness and high-brittleness materials
- Processing flat and regular surface instruments made of ceramics, sapphire, diamond, tungsten steel, and others
-
Processing Capabilities:
- High machining accuracy: ≤±10μm
- Smooth incision with minimal heat-affected zone
- Edge chipping: <15μm
- Minimum product size: 100μm
-
Industries Served:
- Semiconductor manufacturing
- Electronics production
- Precision engineering
Specifications
Performance and Efficiency
Maximum Operating Speeds:
- X, Y1, Y2 Axes: 1000mm/s
- Z Axis: 50mm/s
Positioning Accuracy:
- ±3μm (X, Y1, Y2)
- ±5μm (Z)
Repeatability:
- ±1μm (X, Y1, Y2)
- ±3μm (Z)
Advanced Features
- Self-developed direct-drive motion platform with precision control
- Optional visual positioning and dynamic monitoring systems
- Modular feed and dust ductwork
- Multiple fixture options: vacuum adsorption, honeycomb panels, tension frames
Certified Quality
- ISO9001
- IATF16949
Design Excellence
- Ergonomic and compact design
- Flexible hardware and software configuration for customized needs
- User-friendly interface with self-developed 2D, 2.5D, and 3D CAM software systems
