AQS-EE-5050 Elektronik ekipmanlar için karbondioksit lazer kesim makinesi
- Table size (mm): 500х500
- WT: 0~2±0.05 mm;
- Materials: Non-metallic materials such as biofilm & plastic & rubber & epoxy resin & acrylic & wool & wood and bamboo products & paper;
- Source type: CO2 laser
- Option:
Scope of application
Hassas tıbbi ve elektronik ekipmanlar için biyolojik doku filmlerinin ve 3C plastik yapısal parçaların ve kumaşların lazer mikroişlenmesi.
High precision etching
- Small slit width: ≤80um
- High cutting precision: ≤±30um
- Good cutting quality: no burrs & smooth cuts
- High processing efficiency: the direct-drive mobile gantry precision motion platform is used to cut through the single-layer wall thickness at one time
High precision etching
- Small slit width: ≤80um
- High cutting precision: ≤±30um
- Good cutting quality: no burrs & smooth cuts
- High processing efficiency: the direct-drive mobile gantry precision motion platform is used to cut through the single-layer wall thickness at one time
Strong adaptability
- Possess the ability of fine processing technology such as plane & regular surface laser cutting, drilling, scribing, etc.
- Processable biofilm&plastic&rubber&epoxy resin&acrylic&wool&wood and bamboo products&paper and other non-metallic materials
- Equipped with self-developed servo & direct-drive mobile gantry precision motion platform for selection, compatible with automatic loading and unloading system
- Configure machine vision system & precision fixture & dust removal duct system
- Equipped with self-developed laser micromachining 2D&2.5D&3D CAM software system
Flexible design
- Follow the ergonomic design concept, exquisite and concise
- Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
- Support forward innovative design from component level to system level
- Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface
Technical certification
- THIS
- ISO9001
- IATF16949
Sample Display
Malzemeler
-
Processing Materials:
- Biological tissue films
- 3C plastic structural parts
- Rubber
- Epoxy resin
- Acrylic
- Wool
- Wood and bamboo products
- Paper
-
Laser Specifications:
- CO2 laser
- Wavelength options: 9.3μm, 10.3μm, 10.6μm
- Power options: 80W, 120W, 200W, 250W, 300W
- Material wall thickness: 0~2±0.05mm
Başvuru
-
Scope of Use:
- Laser micromachining for precision medical and electronic equipment
- Processing biofilms, 3C plastic structural parts, and fabrics for high-precision applications
-
Processing Capabilities:
- High precision etching with small slit width: ≤80μm
- Cutting precision: ≤±30μm
- Smooth cuts without burrs
- Single-layer wall thickness processed in one pass
-
Industries Served:
- Medical device manufacturing
- Electronics production
- Precision engineering for structural components
Özellikler
Performance and Efficiency
Maximum Operating Speeds:
- X, Y1, Y2 Axes: 500mm/s
- Z Axis: 30mm/s
Positioning Accuracy:
- ±10μm (X, Y1, Y2, Z)
Repeatability:
- ±4μm (X, Y1, Y2)
- ±5μm (Z)
Advanced Features
- Self-developed servo and direct-drive gantry precision motion platform
- Optional machine vision system for precision targeting
- Dust removal duct system for a clean processing environment
Certified Quality
- ISO9001
- IATF16949
Design Excellence
- Ergonomic and compact design for ease of use
- Flexible hardware and software configuration for customized solutions
- Self-developed 2D, 2.5D, and 3D CAM software systems with a user-friendly interface
