Elektronik Üretimi İçin Alt Tabakalar
20 items-
Altın Kaplama Prob Oluşturma İşlemi
UV lazer kesim makinesi, PCB lazer bölme gibi hassas lazer mikroişleme uygulamaları için tasarlanmış son derece uzmanlaşmış bir ekipmandır. -
Film Kesimi
Film Kesimi, çeşitli film malzemeleri üzerinde karmaşık ve dayanıklı kesimler oluşturmak için tasarlanmış, yüksek hassasiyetli bir lazer mikroişleme çözümüdür. -
PCB ve Fiberglas Kesim ve Şekillendirme
PCB ve Fiberglas Kesme ve Şekillendirme, PCB (Baskılı Devre Kartı) ve fiberglas malzemeler üzerinde karmaşık ve dayanıklı kesimler oluşturmak için tasarlanmış yüksek hassasiyetli bir lazer mikroişleme çözümüdür. -
FPC Cutting and Forming 04
The FPC Cutting and Forming 04 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 03
The FPC Cutting and Forming 03 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 02
The FPC Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 01
The FPC Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
COF Cutting and Forming 02
The COF Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
COF Cutting and Forming 01
The COF Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
5G Copper Foil Antenna Cutting and Forming
The 5G Copper Foil Antenna Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on 5G copper foil antennas. -
Chip Cutting and Forming
The Chip Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on chips. -
Copper Substrate Cutting and Forming
The Copper Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on copper substrates. -
Ceramic Substrate Cutting and Forming
The Ceramic Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on ceramic substrates. -
Ceramic Substrate Scribing
The Ceramic Substrate Scribing is a high-precision laser micromachining solution designed for creating intricate and durable scribing on ceramic substrates. -
Aluminum Substrate Cut Quality
The Aluminum Substrate Cut Quality is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 04
The Aluminum Substrate Cutting and Forming 04 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 03
The Aluminum Substrate Cutting and Forming 03 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 02
The Aluminum Substrate Cutting and Forming 02 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.
