قطع وتشكيل ركيزة الألومنيوم 04

Aluminum Substrate Cutting and Forming 04 – Precision Laser Solution

This is an advanced laser system for cutting and forming aluminum substrates, ideal for electronics and medical applications, delivering superior precision.

The Aluminum Substrate Cutting and Forming 04 from AQ-Laser is a state-of-the-art laser processing solution designed for high-precision micromachining of aluminum substrates used in electronics manufacturing. Tailored for industries such as medical device production, telecommunications, and consumer electronics, this system delivers clean, burr-free cuts and precise forming with minimal thermal impact. Optimized for aluminum substrates, it enables intricate circuit designs and high-density interconnects (HDI) critical for high-performance applications like LED lighting and power electronics. Equipped with automated features such as precise positioning and focusing, it ensures efficient, high-quality production for advanced electronic components.

الميزات الرئيسية:

High-Precision Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
Material Optimization: Processes aluminum substrates with excellent thermal conductivity and lightweight properties.
Low Thermal Impact: Advanced fiber laser technology minimizes heat-affected zones, preserving material integrity.
Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.
مقاومة التآكل: Supports durable aluminum substrates resistant to environmental degradation.

Certification and Standards:

Certified to ISO9001 and IATF16949 standards, ensuring consistent quality for electronics and automotive applications. Compliant with CE marking and RoHS directives for safety and environmental sustainability.

مواد

Aluminum Substrate:

Excellent Thermal Conductivity: Efficiently dissipates heat, ideal for high-power electronics like LED lighting and medical imaging devices.
Lightweight: Reduces overall device weight, enhancing portability for applications in wearables and compact electronics.
Cost-Effective: Offers a balance of performance and affordability, suitable for large-scale electronics manufacturing.
Corrosion Resistance: Resists environmental degradation, ensuring durability in harsh conditions.
Mechanical Strength: Provides robust support for circuit components, maintaining structural integrity under stress.
Recyclability: Environmentally friendly, supporting sustainable manufacturing practices.

Copper Substrate:

Superior Electrical Conductivity: Ensures efficient signal transmission, critical for high-frequency 5G antennas and power electronics.
High Thermal Conductivity: Effectively manages heat dissipation, ideal for high-performance PCBs and medical devices.
Ductility: Allows precise forming and shaping, enabling intricate designs for compact electronic assemblies.
Durability: Resists wear and tear, providing long-term reliability in demanding applications.
Solderability: Facilitates strong, reliable connections in circuit assembly, enhancing manufacturing efficiency.
High-Density Interconnect Support: Enables complex, high-density circuit designs for advanced electronics.

Ceramic Substrate:

Exceptional Thermal Stability: Withstands extreme temperatures, ideal for high-power and high-frequency electronics like RF modules.
Superior Electrical Insulation: Prevents unwanted conductivity, ensuring reliable performance in sensitive medical and telecom devices.
High Mechanical Strength: Maintains structural integrity under stress, supporting precision manufacturing of complex designs.
Chemical Inertness: Resists corrosion from chemicals and environmental factors, ensuring long-term reliability.
Low Dielectric Loss: Enhances signal integrity, making it perfect for high-frequency applications like 5G and radar systems.
Biocompatibility: Suitable for medical implants and diagnostic equipment due to its non-reactive properties.

طلب

High-precision cutting and forming of aluminum substrates for medical devices and consumer electronics.
Contour cutting, drilling, and marking for high-performance printed circuit boards (PCBs).
Processing of aluminum substrates for LED lighting, power modules, and telecommunications equipment.
Suitable for high-density interconnect (HDI) designs in automotive and aerospace applications.

تحديد