Ceramic Substrate Cutting and Forming
- High Adaptability: Compatible with various PCB materials.
- Ergonomic Design: Visual positioning and dynamic monitoring.
- Personalizable: Admite configuraciones personalizadas y producción inteligente.
- Certified Quality: Complies with ISO9001 and IATF16949 standards.
Descripción del Producto
El Ceramic Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on ceramic substrates. Utilizing advanced fiber laser technology, this process ensures exceptional accuracy, smooth finishes, and burr-free edges. It is ideal for applications requiring precise and complex ceramic substrate processing.
Características principales:
- Alta precisión: Precisión de corte de ≤±10µm.
- Acabado liso: Smooth cuts with a seam width of 20~40µm and minimal heat-affected zone.
- Procesamiento eficiente: Direct-drive mobile double-drive system for one-time cutting.
- Versatilidad del material: Compatible with ceramic substrates and other PCB materials.
- Tecnología avanzada: Manufactured using 2D and 2.5D CAM software.
Materiales
-
Ceramic Substrate
-
Aluminum Substrate
-
Copper Substrate
Solicitud
El Ceramic Substrate Cutting and Forming is widely used in the industry for:
-
PCB manufacturing
-
Precision electronics
-
Industrial applications
-
Surface treatment applications
