Sustratos para la fabricación de productos electrónicos
20 artículos-
Corte y conformado de sustratos de aluminio 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Sustrato de cobre diluido de 0,3 mm de grosor formado por láser
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.