Sustratos para la fabricación de productos electrónicos
20 artículos-
Corte y Conformado de Sustratos de Aluminio 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Conformado láser de sustratos de cobre adelgazados WT0.3 mm
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.