Procédé de formation de sonde plaquée or
- Versatile Processing: Supports laser cutting, drilling, scribing, and blind engraving.
- Precision Motion Platform: Features direct-drive XY motion systems with optional fixed gantry and automatic loading/unloading.
- Vacuum Adsorption & Dust Removal: Includes a precision vacuum adsorption fixture and dust removal piping system.
- User-Friendly Software: Open Control & Laser Micromachining Software with a simple, intuitive interface for efficient operation.
Product Description:
The UV laser cutting machine is a highly specialized piece of equipment designed for precision laser micromachining applications such as PCB laser splitting, drilling, and the forming of intricate components like gold-plated probes. It delivers exceptional accuracy and reliability, ensuring the highest standards in precision electronics manufacturing.
Caractéristiques principales :
- High Precision: Cutting seam width: 15~30um with machining accuracy of ≤±10um.
- Superior Cut Quality: Smooth incisions, minimal heat-affected zones, and no burrs for refined results.
- Advanced Material Processing: Capable of cutting ultra-thin composite materials, FPC, PCB, PET, PI, copper foil, aluminum foil, carbon fiber, and ceramics.
- Integrated Vision System: Equipped with bilateral CCD visual positioning and automatic target positioning for enhanced accuracy.
Matériels
Supports various materials including
- FPC, PCB, PET, PI,
- copper foil,
- aluminum foil,
- carbon fiber,
- composite,
- and ceramics.
Application
Ideal for precision micromachining applications, including PCB laser splitting, gold-plated probe forming, flex-rigid board trimming, and advanced electronics manufacturing.
