Категория: Sustratos para la fabricación de productos electrónicos
20 items-
Proceso de formación de sondas chapadas en oro
La máquina de corte por láser UV es un equipo altamente especializado, diseñado para aplicaciones de micromaquinado láser de precisión, como la división láser de PCB. -
Corte de película
Film Cutting es una solución de micromaquinado láser de alta precisión diseñada para crear cortes complejos y duraderos en diversos materiales de película. -
Corte y conformado de PCB y fibra de vidrio
El corte y conformado de PCB y fibra de vidrio es una solución de micromaquinado láser de alta precisión diseñada para crear cortes intrincados y duraderos en materiales de PCB (placa de circuito impreso) y fibra de vidrio. -
Corte y conformado de FPC 04
FPC Cutting and Forming 04 es una solución de micromaquinado láser de alta precisión diseñada para crear cortes intrincados y duraderos en circuitos impresos flexibles (FPC). -
FPC Cutting and Forming 03
The FPC Cutting and Forming 03 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 02
The FPC Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
FPC Cutting and Forming 01
The FPC Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Flexible Printed Circuits (FPC). -
COF Cutting and Forming 02
The COF Cutting and Forming 02 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
COF Cutting and Forming 01
The COF Cutting and Forming 01 is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Chip-On-Film (COF) substrates. -
5G Copper Foil Antenna Cutting and Forming
The 5G Copper Foil Antenna Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on 5G copper foil antennas. -
Chip Cutting and Forming
The Chip Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on chips. -
Copper Substrate Cutting and Forming
The Copper Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on copper substrates. -
Ceramic Substrate Cutting and Forming
The Ceramic Substrate Cutting and Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on ceramic substrates. -
Ceramic Substrate Scribing
The Ceramic Substrate Scribing is a high-precision laser micromachining solution designed for creating intricate and durable scribing on ceramic substrates. -
Aluminum Substrate Cut Quality
The Aluminum Substrate Cut Quality is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 04
The Aluminum Substrate Cutting and Forming 04 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 03
The Aluminum Substrate Cutting and Forming 03 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Aluminum Substrate Cutting and Forming 02
The Aluminum Substrate Cutting and Forming 02 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.
