Hard and Brittle Devices
10 itemsCustomized forming of Hard and Brittle Devices according to your specifications
At AQ-Laser, you can order Hard and Brittle Devices according to your individual drawings and other requirements. We are a manufacturer of laser machines for high-precision metal cutting and microprocessing, carrying out custom laser cutting projects for the medical, micro-engineering, and related industries.
What type of Hard and Brittle Devices do we offer?
- Glass cutting for micro-slots and holes
- Piezoelectric ceramic device laser cutting
- Quartz crystal structure machining
- Alumina ceramic microstructure forming
- Hard brittle material perforated sheet cutting
- Silicon wafer laser patterning
- Diamond substrate micro-machining
- Glass ceramic optical component cutting
Why choose us?
Individual approach — we work according to your drawings, taking into account all technological requirements and details.
Own production and equipment — all work is performed on our high-precision laser machines, ensuring quality control at every stage.
Accuracy and compliance with tolerances — we are experienced in working with micrometer-scale sizes and strict requirements typical for medical products.
Meeting deadlines — we understand how important delivery times are for our clients and strictly adhere to them.
Delivery across the United States and worldwide.
Quality assurance and support — quality control at every stage, rework and maintenance if necessary.
Confidentiality — your drawings and technical requirements are kept strictly confidential and protected by agreements.
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Ceramic Plate Slotting
Ceramic Plate Slotting is a precision machining process designed for creating slots and grooves in ceramic plates. -
Silicon Oxide Ceramics WT0.2mm Drilling
The Silicon Oxide Ceramics WT0.2mm Drilling is a precision drilling solution designed for creating ultra-fine holes in hard and brittle materials. -
Zirconia Ceramics WT0.7mm Scribe
The Zirconia Ceramics WT0.7mm Scribe is a precision tool designed for high-accuracy scribing and marking on hard and brittle materials. -
Sapphire Drilling Processing
Sapphire Drilling Processing is a high-precision machining service designed for creating intricate holes and patterns in sapphire materials. -
Mobile Phone Back Cover Ceramic Molding
Mobile Phone Back Cover Ceramic Molding is a high-precision component designed for modern smartphones, offering a perfect blend of durability, aesthetics, and functionality. -
Tungsten Steel Sheet Cutting and Forming
Tungsten Steel Sheet Cutting and Forming is a precision process designed for creating high-strength, durable components from tungsten steel. -
Sapphire Molding
Sapphire Molding is a precision component designed for use in high-tech industries, particularly in applications requiring exceptional hardness, thermal stability, and optical clarity. -
Zirconium Nitride Ceramic Molding
The Zirconium Nitride Ceramic Molding is a high-precision laser micromachining solution designed for creating intricate and durable molds in zirconium nitride ceramic materials. -
Zirconium Nitride WT0.2mm-0.12mm Micro Hole Forming
The Zirconium Nitride WT0.2mm-0.12mm Micro Hole Forming is a high-precision laser micromachining solution designed for creating intricate and durable micro holes in zirconium nitride materials. -
MIM Watch Ring Forming
The MIM Watch Ring Forming is a high-precision laser micromachining solution designed for creating intricate and durable cuts on Metal Injection Molding (MIM) watch rings.
