Silicon Oxide Ceramics WT0.2mm Drilling

High Accuracy: Drilling precision of ≤±10µm ensures consistent quality.
Smooth Finish: Minimal burrs and edge chipping (<15µm) for a flawless surface.
Adaptability: Compatible with 2D, 2.5D, and 3D drilling patterns.
Eco-Friendly: Designed for minimal material waste and energy-efficient production.

Product Description

The Silicon Oxide Ceramics WT0.2mm Drilling is a precision drilling solution designed for creating ultra-fine holes in hard and brittle materials. Utilizing advanced laser micromachining technology, this process ensures exceptional accuracy, smooth edges, and minimal thermal damage. With a drilling diameter of 0.2mm, it is ideal for applications requiring high precision and reliability in industries such as electronics, optics, and medical devices.

Key Features:

Ultra-High Precision: Drilling diameter of 0.2mm ensures flawless results.
Minimal Thermal Impact: Small heat-affected zone and smooth incision quality.
Exceptional Durability: Silicon oxide ceramics offer superior hardness and thermal stability.
Versatility: Capable of drilling in various hard and brittle materials.
Customizable: Supports various shapes, sizes, and patterns to meet specific requirements.

Materials

Primary Material: Silicon oxide ceramics (SiO₂) – known for high hardness, thermal stability, and electrical insulation.
Compatible Materials: Alumina, zirconia, silicon nitride, sapphire, and other high-performance ceramics.

Application

Silicon Oxide Ceramics WT0.2mm Drilling is widely used in the following industries:

Electronics: Precision drilling for semiconductor wafers and microelectronics.
Medical Devices: Surgical tools, implants, and diagnostic equipment.
Optics: Creating fine holes in lenses and optical components.
Industrial Tools: High-precision drilling for cutting and forming tools.
Research and Development: Prototyping and testing of advanced materials.