Silicon Oxide Ceramics WT0.2mm Drilling

Silicon Oxide Ceramics WT0.2mm Drilling – Precision Laser Solution

This is a high-precision laser drilling system for ultra-thin silicon oxide ceramics, ideal for electronics and medical applications, delivering exceptional accuracy.

The Silicon Oxide Ceramics WT0.2mm Drilling system from AQ-Laser is an advanced laser processing solution designed for high-precision micro-drilling of ultra-thin silicon oxide ceramic substrates with a thickness of 0.2mm. Tailored for industries such as semiconductor manufacturing, medical device production, and high-frequency electronics, this system delivers clean, burr-free micro-holes with minimal thermal impact. Optimized for hard and brittle silicon oxide ceramics, it enables intricate designs critical for high-performance applications like RF modules and medical sensors. Equipped with automated features such as precise positioning and focusing, it ensures efficient, high-quality production for advanced electronic components.

Key Features:

• High-Precision Drilling: Achieves drilling accuracy of ≤±10μm for micro-holes in ultra-thin ceramics.
• Material Optimization: Processes 0.2mm silicon oxide ceramics with high hardness and brittleness.
• Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
• Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
• CleanCut Technology: Ensures burr-free and carbonization-free holes, enhancing technical cleanliness.
• High Corrosion Resistance: Supports durable ceramics resistant to chemical and environmental degradation.

Certification and Standards:

Certified to ISO9001 and IATF16949 standards, ensuring consistent quality for electronics and automotive applications. Compliant with CE marking and RoHS directives for safety and environmental sustainability.