AQS-HB-6045 Laser cutting machine for precision hard and brittle materials

Table size (mm): 300mm*300mm; (larger format requirements support customization)
WT: 0~2.0±0.02 mm
Materials: Alumina & Zirconia & Aluminum Nitride & Zirconium Nitride & Silicon Nitride & Diamond & Sapphire & Silicon & Germanium & Gallium Arsenide & Tungsten Steel, etc.;
Source type: Fiber
Option:

Application:

Scope of application

Laser micromachining of ceramics, sapphire, diamond, tungsten steel and other high hardness & high brittleness plane and regular surface instruments.

High finishing

Cutting seam width: 15~30um
High machining accuracy: ≤±10um
Good incision quality: smooth incision & small heat-affected zone & few burrs & edge chipping <15um
Size refinement: minimum product size 100um

Possess the ability of fine processing technology such as laser cutting, drilling, slotting, scribing and so on for flat & curved instruments
Machinable alumina & zirconia & aluminum nitride & silicon nitride & diamond & sapphire & silicon & gallium arsenide & tungsten steel and other materials
Equipped with self-developed direct-drive mobile double-drive precision motion platform, granite platform, aluminum alloy & granite beam for selection
Provide optional functions such as double station & visual positioning & automatic loading and unloading system & processing dynamic monitoring
Equipped with self-developed long & short focal length sharp & flat fine laser cutting head
Configure modular feed and dust ductwork
Provide self-developed movable tension frame & fixed tension frame & vacuum adsorption & honeycomb panel and other fixture options
Equipped with self-developed laser micromachining 2D & 2.5D & 3D CAM software system

Follow the ergonomic design concept, exquisite and concise
Flexible combination of software & hardware functions, support personalized function configuration & intelligent production management
Support forward innovative design from component level to system level
Open Control & Laser Micromachining Software System Easy Operation & Intuitive Interface

Materials

Processing Materials:
- Alumina
- Zirconia
- Aluminum Nitride
- Silicon Nitride
- Diamond
- Sapphire
- Silicon
- Germanium
- Gallium Arsenide
- Tungsten Steel
Laser Specifications:
- Fiber-optic laser
- Wavelength: 1030~1070±10nm
- Power Options: CW1000W, QCW150W, QCW300W, QCW450W
- Cutting Seam Width: 15~30μm
- Material Wall Thickness: 0~2.0±0.02mm

Application

Scope of Use:
- Laser micromachining of high-hardness and high-brittleness materials
- Processing flat and regular surface instruments made of ceramics, sapphire, diamond, tungsten steel, and others
Processing Capabilities:
- High machining accuracy: ≤±10μm
- Smooth incision with minimal heat-affected zone
- Edge chipping: <15μm
- Minimum product size: 100μm
Industries Served:
- Semiconductor manufacturing
- Electronics production
- Precision engineering

Specifications

Maximum Operating Speeds:

Positioning Accuracy:

Repeatability:

Ergonomic and compact design
Flexible hardware and software configuration for customized needs
User-friendly interface with self-developed 2D, 2.5D, and 3D CAM software systems