Substrates for Electronics Manufacturing
20 items-
Aluminum Substrate Cutting and Forming 01
The Aluminum Substrate Cutting and Forming 01 is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications. -
Thinned Copper Substrate WT0.3mm Laser Forming
The Thinned Copper Substrate WT0.3mm Laser Forming is a high-precision laser-cut component designed for use in PCB (Printed Circuit Board) applications.