Notebook ABS Case Cooling Hole Cutting, Punching and Forming

Notebook ABS Case Cooling Hole Cutting, Punching and Forming – Precision Laser Solution

This is a high-precision laser system for cutting, punching, and forming cooling holes in ABS notebook cases, ideal for consumer electronics, ensuring optimal thermal management.

The Notebook ABS Case Cooling Hole Cutting, Punching and Forming system from AQ-Laser is an advanced laser processing solution designed for high-precision micromachining of acrylonitrile butadiene styrene (ABS) notebook cases. Tailored for the consumer electronics industry, this system creates precise cooling holes and intricate designs with clean, burr-free edges and minimal thermal impact. Optimized for ABS’s durability and lightweight properties, it ensures efficient heat dissipation for high-performance devices. Equipped with automated features like precise positioning, focusing, and optional conveyor systems, it delivers consistent, high-quality production for complex notebook case designs.

Key Features:

• High-Precision Processing: Achieves cutting and punching accuracy of ≤±10μm for intricate, burr-free cooling holes.
• Material Optimization: Processes ABS with excellent impact resistance and lightweight properties.
• Low Thermal Impact: Advanced CO2 laser technology minimizes heat-affected zones, preserving material integrity.
• Automated Efficiency: Includes automatic positioning, focusing, and optional conveyor systems for streamlined production.
• CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and aesthetic quality.
• Thermal Management: Supports precise cooling hole designs for optimal heat dissipation in notebook cases.

Certification and Standards:

Certified to ISO9001 standards, ensuring consistent quality for consumer electronics applications. Compliant with CE marking and RoHS directives for safety and environmental sustainability.