FPC Cutting and Forming 01

FPC Cutting and Forming 01 – High-Precision Laser Solution

This is a cutting-edge laser system for processing flexible printed circuits (FPCs), perfect for medical and electronics applications, offering unmatched precision.

Description:

The FPC Cutting and Forming 01 from AQ-Laser is an advanced laser processing system designed for high-precision micromachining of flexible printed circuits (FPCs) and related substrates. Tailored for industries like medical device manufacturing and consumer electronics, this system delivers clean, burr-free cuts and precise forming with minimal thermal impact. It supports a wide range of flexible materials, including polyimide (PI), PET, and FCCL, enabling intricate circuit designs and high-density interconnects (HDI). Equipped with automated features such as precise positioning and focusing, it ensures efficient, high-quality production for complex electronic components.

Key Features:

Ultra-Precise Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
Broad Material Compatibility: Processes flexible substrates like polyimide (PI), PET, FCCL, coverlay, and rigid-flex boards with ease.
Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.

Certification and Standards:

Conforms to global standards for electronics manufacturing. Adheres to strict quality and safety regulations.

Materials

FPC (Flexible Printed Circuit):

Flexibility: Enables bending and folding for compact designs in medical and electronic devices.
Lightweight: Thin and low-mass material reduces device weight for enhanced portability.
High Reliability: Supports complex circuit layouts with excellent thermal and electrical stability.
Miniaturization: Ideal for high-density, small-scale applications in wearables and implants.

PET (Polyethylene Terephthalate):

Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
Cost-Effective: Economical material for large-scale production of medical and electronic components.
Transparency: Ideal for optical applications in diagnostic and laboratory devices.

PI (Polyimide):

High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
Flexibility: Supports intricate designs in compact, high-performance electronic devices.

Copper Foil:

Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
Thin and Lightweight: Enables precision applications in electronics and medical sensors.
Malleability: Easily shaped for intricate designs in circuit boards and conductive components.

Aluminum Foil:

Lightweight: Low density reduces overall weight in medical and industrial applications.
Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
High Conductivity: Supports efficient electrical and thermal performance in electronic components.
Cost-Effective: Affordable material for large-scale production of precision parts.

Application

High-precision cutting and forming of FPCs for medical devices, wearables, and consumer electronics.
Contour cutting, drilling, and marking of flexible and rigid-flex circuit boards.
Processing of cover films, adhesives, and EMI shielding films for compact electronic designs.
Suitable for high-density interconnect (HDI) designs in telecommunications and automotive applications.

Specifications

Laser Type: High-performance UV laser
Cutting Accuracy: ≤±10μm
Cutting Seam Width: 15–30μm
Material Compatibility: Polyimide (PI), PET, FCCL, coverlay, rigid-flex boards
Processing Capabilities: Contour cutting, drilling, marking, and forming
Automation: Automatic positioning, focusing, and feeding systems
Supported Formats: Gerber, DXF, DWG, SVG, and other 2D CAD formats