COF Cutting and Forming 02

COF Cutting and Forming 02 – Precision Laser Processing

This is an advanced laser system for chip-on-film (COF) processing, ideal for electronics and medical applications, delivering superior accuracy.

The COF Cutting and Forming 02 from AQ-Laser is a state-of-the-art laser processing system engineered for high-precision micromachining of chip-on-film (COF) substrates and related materials. Designed for industries such as consumer electronics, medical device manufacturing, and semiconductor production, this system ensures clean, burr-free cuts and precise forming with minimal thermal impact. It supports a variety of flexible materials, including polyimide (PI), PET, and FCCL, enabling intricate circuit designs and high-density interconnects (HDI). With advanced automation features like precise positioning and focusing, it optimizes production efficiency while maintaining exceptional quality for complex electronic components.

Key Features:

High-Precision Cutting: Achieves cutting accuracy of ≤±10μm and seam widths of 15–30μm for intricate, burr-free designs.
Material Versatility: Processes flexible substrates like polyimide (PI), PET, FCCL, and coverlay with ease.
Low Thermal Impact: Advanced UV laser technology minimizes heat-affected zones, preserving material integrity.
Automated Efficiency: Includes automatic positioning, focusing, and feeding systems for streamlined production.
CleanCut Technology: Ensures carbonization-free edges, enhancing technical cleanliness and reliability.

Certification and Standards:

Meets global standards for electronics manufacturing. Complies with international quality and safety regulations.

Materials

COF Substrates:

High Flexibility: Enables bending and folding without compromising electrical performance, ideal for compact and wearable devices.
Miniaturization Support: Facilitates high-density interconnects (HDI) for intricate, space-saving circuit designs.
Durability: Resists mechanical stress and environmental factors, ensuring long-term reliability in demanding applications.
Thermal Stability: Maintains performance under high temperatures, suitable for advanced electronics and medical devices.
Lightweight Design: Reduces overall device weight, enhancing portability in consumer and medical applications.
Versatile Material Compatibility: Supports polyimide (PI), PET, and FCCL, allowing diverse manufacturing applications.
Precision Processing: Compatible with advanced laser cutting and forming, delivering clean, burr-free edges for high-quality production.

PET (Polyethylene Terephthalate):

Chemical Resistance: Withstands exposure to medical and industrial chemicals for reliable performance.
Flexibility and Strength: Combines durability with flexibility for use in flexible displays and sensors.
Cost-Effective: Economical material for large-scale production of medical and electronic components.
Transparency: Ideal for optical applications in diagnostic and laboratory devices.

PI (Polyimide):

High Thermal Stability: Withstands temperatures up to 400°C, perfect for high-heat medical and industrial applications.
Excellent Dielectric Properties: Ensures reliable insulation in flexible circuits and sensors.
Chemical Resistance: Resists harsh chemicals, enhancing longevity in medical environments.
Flexibility: Supports intricate designs in compact, high-performance electronic devices.

Copper Foil:

Superior Conductivity: Offers excellent electrical conductivity for high-performance circuits and probes.
Corrosion Resistance: Ensures durability in medical and industrial environments with minimal degradation.
Thin and Lightweight: Enables precision applications in electronics and medical sensors.
Malleability: Easily shaped for intricate designs in circuit boards and conductive components.

Aluminum Foil:

Lightweight: Low density reduces overall weight in medical and industrial applications.
Corrosion Resistance: Resists oxidation, ensuring durability in harsh environments.
High Conductivity: Supports efficient electrical and thermal performance in electronic components.
Cost-Effective: Affordable material for large-scale production of precision parts.

Application

High-precision cutting and forming of COF substrates for medical devices, displays, and consumer electronics.
Contour cutting, drilling, and marking of flexible circuit materials.
Processing of cover films and adhesives for compact, high-performance electronics.
Suitable for high-density interconnect (HDI) designs in telecommunications and wearable technology.

Specifications